13000 / 13113 - Publikace - 2019

13000 / 13113 - katedra elektrotechnologie

Publikační činnost 2019

Články v časopisech WoS

LEDINSKY, M. et al. Temperature Dependence of the Urbach Energy in Lead Iodide Perovskites. Journal of Physical Chemistry Letters. 2019, 10(6), 1368-1373. ISSN 1948-7185. DOI 10.1021/acs.jpclett.9b00138.

KRAMMER, O. a K. DUŠEK. Numerical investigation on the effect of the printing force and squeegee geometry on stencil printing. Journal of Manufacturing Processes. 2019, 45 188-193. ISSN 1526-6125. DOI 10.1016/j.jmapro.2019.06.021.

BOLDRIN, D. et al. The Biaxial Strain Dependence of Magnetic Order in Spin Frustrated Mn3NiN Thin Films. Advanced Functional Materials. 2019, 29 ISSN 1616-301X. DOI 10.1002/adfm.201902502.

STRAUBINGER, D. et al. Advances on high current load effects on lead-free solder joints of SMD chip-size components and BGAs. Circuit World. 2019, 45(1), 37-44. ISSN 0305-6120. DOI 10.1108/CW-11-2018-0088.

CINERT, J. et al. PREPARATION OF ZrB2 BY BORO/CARBOTHERMAL REDUCTION IN SPS DEVICE. Ceramics-Silikáty. 2019, 63(1), 93-99. ISSN 0862-5468. DOI 10.13168/cs.2019.0001.

PETER AMALATHAS, A. et al. Concentration-Dependent Impact of Alkali Li Metal Doped Mesoporous TiO2 Electron Transport Layer on the Performance of CH3NH3PbI3 Perovskite Solar Cells. The Journal of Physical Chemistry C. 2019, 123(32), 19376-19384. ISSN 1932-7447. DOI 10.1021/acs.jpcc.9b05355.

TESAŘ, K. et al. Fe-stabilized duplex alpha/beta microstructure containing gamma titanium hydride in Ti grade 2 obtained by volumetrically incomplete phase transition. Materials Characterization. 2019, 153 128-135. ISSN 1044-5803. DOI 10.1016/j.matchar.2019.04.045.

FRAGAKI, A., T. MARKVART a G. LASKOS. All UK electricity supplied by wind and photovoltaics – The 30–30 rule. Energy. 2019, 169 228-237. ISSN 0360-5442. DOI 10.1016/j.energy.2018.11.151.

ILLÉS, B. et al. The influence of the crystallographic structure of the intermetallic grains on tin whisker growth. Journal of Alloys and Compounds. 2019, 785 774-780. ISSN 0925-8388. DOI 10.1016/j.jallcom.2019.01.247.

MUSIIENKO, A. et al. Deep levels, charge transport and mixed conductivity in organometallic halide perovskites. ENERGY & ENVIRONMENTAL SCIENCE. 2019, 12(4), 1413-1425. ISSN 1754-5692. DOI 10.1039/c9ee00311h.

HOLOVSKÝ, J. et al. Lead Halide Residue as a Source of Light-Induced Reversible Defects in Hybrid Perovskite Layers and Solar Cells. ACS Energy Letters. 2019, 4 3011-3017. ISSN 2380-8195. DOI 10.1021/acsenergylett.9b02080. Dostupné z: https://pubs.acs.org/doi/full/10.1021/acsenergylett.9b02080

ILLÉS, B. et al. Effect of Cu Substrate Roughness and Sn Layer Thickness on Whisker Development from Sn Thin-Films. Materials. 2019, 12(21), ISSN 1996-1944. DOI 10.3390/ma12213609.

KOTLAN, J., R.C. SESHADRI a P. CTIBOR. Electrical and Optical Properties of Plasma-Sprayed Yttria. METALLURGICAL AND MATERIALS TRANSACTIONS A. 2019, 50(1), 504-511. ISSN 1073-5623. DOI 10.1007/s11661-018-4994-4.

BOLDRIN, D. et al. Anomalous Hall effect in noncollinear antiferromagnetic Mn3NiN thin films. Physical Review Materials. 2019, 3 ISSN 2475-9953. DOI 10.1103/PhysRevMaterials.3.094409. Dostupné z: https://doi.org/10.1103/PhysRevMaterials.3.094409

ALAYA, M.A. et al. Advances in Pressure Sensing for Vapour Phase Soldering Process Monitoring. Soldering & Surface Mount Technology. 2019, 31(3), 169-175. ISSN 0954-0911. DOI 10.1108/SSMT-10-2018-0038.

DZURŇÁK, B. et al. Hot photons and open-circuit voltage in molecular absorbers. Semiconductor Science and Technology. 2019, 34(12), ISSN 0268-1242. DOI 10.1088/1361-6641/ab419f.

FUKAL, J. et al. Structural interpretation of the 31P NMR chemical shifts in thiophosphate and phosphate: key effects due to spin–orbit and explicit solvent. Physical Chemistry Chemical Physics. 2019, 21(19), 9924-9934. ISSN 1463-9076. DOI 10.1039/c9cp01460h.

STRAUBINGER, D. et al. Modelling of temperature distribution along PCB thickness in different substrates during reflow. Circuit World. 2019, 46(2), 85-92. ISSN 0305-6120. DOI 10.1108/CW-07-2019-0074.

MACH, P. et al. Glass transition temperature of nanoparticle-enhanced and environmentally stressed conductive adhesive materials for electronics assembly. Journal of Materials Science: Materials in Electronics. 2019, 30(5), 4895-4907. ISSN 0957-4522. DOI 10.1007/s10854-019-00784-5.

Patenty a užitné vzory

Czech Technical University. Device for automatic testing of power capacitors. Původci: V. PAPEŽ. European Patent Office. Patent EP2765428. 2019-09-25. Dostupné z: https://worldwide.espacenet.com/publicationDetails/biblio?CC=EP&NR=2765428B1&KC=B1&FT=D&ND=1&date=20190925&DB=&locale=en_EP#

ČVUT v Praze. Ruční dávkovač pastovitých látek. Původci: R. BORTEL et al. Česká republika. Užitný vzor CZ 33441. 2019-12-03. Dostupné z: https://isdv.upv.cz/webapp/resdb.print_detail.det?pspis=PUV/36310&plang=CS

Czech Technical University in Prague. Electromechanical Transducer. Původci: V. BOUDA. European Patent Office. Patent EP2002535. 2019-05-15. Dostupné z: https://worldwide.espacenet.com/publicationDetails/originalDocument?FT=D&date=20190515&DB=&locale=en_EP&CC=EP&NR=2002535B1&KC=B1&ND=6

České vysoké učení technické v Praze, Jugoslávských partyzánů 1580/3, 160 00 Praha 6, Dejvice, Česká republika. Zařízení pro nabíjení akumulátorů z fotovoltaického zdroje. Původci: V. PAPEŽ. Česká republika. Patent CZ 308050. 2019-10-09. Dostupné z: https://isdv.upv.cz/webapp/resdb.print_detail.det?pspis=PT/2018-593

Články v ostatních periodikách

VESELÝ, P. et al. Development of Low-Cost Solder Paste Hand Dispenser. ElectroScope. 2019, 2019(2), ISSN 1802-4564. Dostupné z: http://147.228.94.30/images/PDF/Rocnik2019/Cislo2_2019/r13c2c18.pdf

BARTO, S. a P. MACH. Elektricky vodivá lepidla pro elektrotechniku. Elektro. 2019,(1), 6-9. ISSN 1210-0889.

BENDA, V. Hlavní vývojové trendy ve fotovoltaice. TZB Haustechnik. 2019, XIII(1/2019), 38-40. ISSN 1803-4802.

MACH, P. a R. POLANSKÝ. Aplikace vodivých lepidel z pohledu termomechanických vlastností. ElectroScope. 2019,(2), ISSN 1802-4564. Dostupné z: http://147.228.94.30/images/PDF/Rocnik2019/Cislo2_2019/r13c2c12.pdf

HORÁK, M. a V. PAPEŽ. Model degradace kondenzátorů s metalizovanou elektrodou. Energetika. 2019, 69 178-184. ISSN 0375-8842.

SOROKINA, K., D. BUŠEK a K. DUŠEK. Electrochemical migration of lead-free solders and Ag-based electrically conductive adhesives in NaCl solution. ElectroScope. 2019, 2019(2), ISSN 1802-4564. Dostupné z: http://hdl.handle.net/11025/36515

HRZINA, P. Pohled na flexibilitu domácností. Vytápění, větrání, instalace. 2019, 28 88-90. ISSN 1210-1389.

HRZINA, P. Šneci na postupu. TZB Haustechnik. 2019, 13(1), 36-37. ISSN 1803-4802.

PAPEŽ, V. a S. PAPEŽOVÁ. Effective control and battery charging system of an island PV power plant. Agronomy Research. 2019, 17(special issue 1), 1181-1190. ISSN 1406-894X. DOI 10.15159/AR.19.122.

Stati ve sbornících konferencí

KRAJČOVÁ, V. a P. HRZINA. New possibilities of teaching physics based on secondary school students’ projects. In: AIP Conference Proceedings. DIDFYZ 2019: Formation of the Natural Science Image of the World in the 21st Century, Terchova, 2019-10-09/2019-10-12. Melville, NY: AIP Publishing, 2019. ISSN 0094-243X. ISBN 978-0-7354-1897-4. DOI 10.1063/1.5124759.

BENDA, V. Photovoltaic Cells and Modules for Future Energy Systems. In: Book of Abstracts - APMAS 2019. 9thInternational Advances in Applied Physics & Materials Science Congress & Exhibition, Oludeniz, 2019-10-22/2019-10-28. Gebze Technical University, 2019. s. 35-36. Dostupné z: http://www.apmascongress.org/images/files/apmas2019_abstract_book.pdf

FINSTERLE, T. et al. Impact of Defective Modules on the Characteristics of a Large-Scale Grid-Connected PV Power Plant. In: EU PVSEC 2019 Proceedings. EU PVSEC 2019, Marseille, 2019-09-09/2019-09-13. Munich: WIP - Renewable Energies, 2019. s. 1667-1669. ISSN 2196-100X. ISBN 978-3-936338-60-7. DOI 10.4229/EUPVSEC20192019-5CV.4.42.

PETRÁŠEK, J. Synthesis and Spark Plasma Sintering of CaCu3Ti4O12. In: Proceedings of the International Student Scientific Conference Poster – 23/2019. 23rd International Student Conference on Electrical Engineering POSTER 2019, ČVUT FEL, Technická 2, Praha 6, 2019-05-23. Praha: ČVUT FEL, Středisko vědecko-technických informací, 2019. s. 326-327. 1. sv. 1. ISBN 978-80-01-06581-5. Dostupné z: http://poseidon2.feld.cvut.cz/conf/poster/

MACH, P. a M. HORÁK. Loss factor and non-linearity of volt-ampere characteristic of capacitors from metalized PP film. In: 2019 42nd International Spring Seminar on Electronics Technology (ISSE). 42nd International Spring Seminar on Electronics Technology, Wroclaw, 2019-05-15/2019-05-19. New York: IEEE Press, 2019. s. 292-296. International Spring Seminar on Electronics Technology ISSE. ISSN 2161-2536. ISBN 978-1-7281-1874-1. DOI 10.1109/ISSE.2019.8810267. Dostupné z: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=8810267

DUŠEK, K. Pájení - fenomén povrchového napětí. In: SMT info 10/19 Bulletin anotací. SMT info 10/19, Brno, 2019-10-15/2019-10-16. Brno: SMT Info, 2019. s. 5-9. ISSN 1211-6947.

FINSTERLE, T. et al. Microscopic study of multifunctional drug molecule adhesion to electronic biosensors coated with diamond and gold nanoparticles. In: 10TH ANNIVERSARY INTERNATIONAL CONFERENCE ON NANOMATERIALS - RESEARCH & APPLICATION (NANOCON 2018). NANOCON 2018 - 10th Anniversary International Conference on Nanomaterials - Research & Application, Brno, 2018-10-17/2018-10-19. Ostrava: TANGER, 2019. s. 380-385. ISBN 978-80-87294-89-5.

REICHL, T. NÍZKOENERGETICKÝ IMPULZNÍ TEST NA ELEKTROCHEMICKÉM ČLÁNKU. In: Zborník príspevkov z medzinárodnej konferencie ELEKTROTECHNOLÓGIA 2019. ELEKTROTECHNOLÓGIA 2019, Zuberec, 2019-05-21/2019-05-23. Žilina: Združenie elektrotechnikov Slovenska, 2019. s. 106-109. ISBN 978-80-969729-1-3.

FINSTERLE, T. et al. Microscopic study of multifunctional drug molecule adhesion to coatings with diamond and gold nanoparticles. In: Hasselt Diamond Workshop 2019 - SBDD XXIV. Hasselt, 2019-03-13/2019-10-15. Berlin: Wiley-VCH Verlag GmbH & Co. KGaA, 2019. s. 44.

MACH, P. a J. SOKOL. Application of More-level Stress on Conductive Adhesive Joints. In: CHINDRIS, G. a B. MIHAJLESCU, eds. IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME). Cluj-Napoca, 2019-10-23/2019-10-26. Bucharest: Politehnica, 2019. s. 142-145. ISBN 978-1-7281-3330-0. DOI 10.1109/SIITME47687.2019.8990770.

HRZINA, P. a L. ČERNÁ. Pohled na obvodové simulace velkých PV elektráren. In: CHLADIL, L. a P. BAČA, eds. 40. Nekonvenční zdroje elektrické energie. Vémyslice, 2019-05-15/2019-05-17. Praha: Česká elektrotechnická společnost, 2019. s. 33-36. ISBN 978-80-02-02858-1.

TICHÝ, T. et al. Application Possibilities of Fused Filament Fabrication Technology for High-Voltage and Medium-Voltage Insulation Systems. In: 2019 42nd International Spring Seminar on Electronics Technology (ISSE). 42nd International Spring Seminar on Electronics Technology, Wroclaw, 2019-05-15/2019-05-19. New York: IEEE Press, 2019. International Spring Seminar on Electronics Technology ISSE. ISSN 2161-2528. ISBN 978-1-7281-1875-8. DOI 10.1109/ISSE.2019.8810300.

PODRAPSKÝ, J. a M. KOZÁK. VIRTUAL COMMISSIONING / DIGITAL TWIN. In: XXXVI. CELOSTÁTNÍ KONFERENCE O ELEKTRICKÝCH POHONECH. Plzeň, 2019-06-11/2019-06-12. Praha: Česká elektrotechnická společnost, 2019. s. 1-14. ISBN 978-80-02-02860-4.

DUŠEK, K. et al. Ruční dávkovač pájecí pasty s velmi nízkými výrobními náklady. In: SMT info 10/19 Bulletin anotací. SMT info 10/19, Brno, 2019-10-15/2019-10-16. Brno: SMT Info, 2019. s. 29-30. ISSN 1211-6947.

BĚHAL, D., T. TICHÝ a L. DVOŘÁČEK. Economic Evaluation of FDM 3D Printing Method. In: Proceedings of the International Student Scientific Conference Poster – 23/2019. 23rd International Student Conference on Electrical Engineering POSTER 2019, ČVUT FEL, Technická 2, Praha 6, 2019-05-23. Praha: ČVUT FEL, Středisko vědecko-technických informací, 2019. s. 211-212. 1. sv. 1. ISBN 978-80-01-06581-5. Dostupné z: http://poseidon2.feld.cvut.cz/conf/poster/

VESELÝ, P., K. DUŠEK a A. STAŇKOVÁ. Evaluation of Bismuth/Tin Solder Intermetallic Layers Based on Heating Factor. In: 2019 42nd International Spring Seminar on Electronics Technology (ISSE). 42nd International Spring Seminar on Electronics Technology, Wroclaw, 2019-05-15/2019-05-19. New York: IEEE Press, 2019. International Spring Seminar on Electronics Technology ISSE. ISSN 2161-2528. ISBN 978-1-7281-1875-8. DOI 10.1109/ISSE.2019.8810306.

BENDA, V. PV cells and modules - state of art, trends and limits. In: Program & Abstracts, 2019 EMN JEJU MEETING. 2019 EMN Jeju Meeting, Maison Glad Jeju, 2019-05-20/2019-05-24. Institute of Fundamental and Frontier Sciences, 2019. s. 29-30.

ŠARŠOUNOVÁ, Z. The Inconveniences Related to Accelerated Thermal Ageing of Cables. In: Transportation Research Procedia. TRANSCOM 2019 13th International Scientific Conference on Sustainable, Modern and Safe Transport, High Tatras, Novy Smokovec, 2019-05-29/2019-05-31. Kidlington Oxford OX GB: Elsevier, 2019. s. 90-95. sv. 40. ISSN 2352-1457. DOI 10.1016/j.trpro.2019.07.015.

MACH, P. a S. BARTO. Study of Modification of Conductive Adhesive by Nanoparticles and Aging of Modified Adhesive. In: CHINDRIS, G. a B. MIHAJLESCU, eds. IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME). Cluj-Napoca, 2019-10-23/2019-10-26. Bucharest: Politehnica, 2019. s. 118-121. ISBN 978-1-7281-3330-0. DOI 10.1109/SIITME47687.2019.8990752.

VLK, A. et al. Detection and Characterization of Defect States in Organometallic Halide Perovskites. In: Proceedings of nanoGe Fall Meeting19 (NFM19). nanoGe Fall Meeting 2019, Berlin, 2019-11-03/2019-11-08. Valencia: Fundació Scito, 2019.

MOLHANEC, M. Study of Solder Spreadability at Different Soldering Conditions Using Factorial Experiments. In: 2019 42nd International Spring Seminar on Electronics Technology (ISSE). 42nd International Spring Seminar on Electronics Technology, Wroclaw, 2019-05-15/2019-05-19. New York: IEEE Press, 2019. International Spring Seminar on Electronics Technology ISSE. ISSN 2161-2536. ISBN 978-1-7281-1874-1. DOI 10.1109/ISSE.2019.8810262. Dostupné z: https://ieeexplore.ieee.org/document/8000955

REICHL, T. Difúzní proces jako dignostika elektrochemického článku. In: 40. NEKONVEČNÍ ZDROJE ELEKTRICKÉ ENERGIE. Vémyslice, 2019-05-14/2019-05-17. Praha: Česká elektrotechnická společnost, 2019. s. 97-100. ISBN 978-80-02-02858-1.

FINSTERLE, T. et al. PID EFEKT, DIAGNOSTIKA A DŮSLEDKY. In: 40. NEKONVEČNÍ ZDROJE ELEKTRICKÉ ENERGIE. Vémyslice, 2019-05-14/2019-05-17. Praha: Česká elektrotechnická společnost, 2019. s. 24-28. ISBN 978-80-02-02858-1.

MACH, P. a F. ZÁVORA. Influence of temperature shocks on climatic aging of conductive adhesive joints. In: 2019 42nd International Spring Seminar on Electronics Technology (ISSE). 42nd International Spring Seminar on Electronics Technology, Wroclaw, 2019-05-15/2019-05-19. New York: IEEE Press, 2019. s. 297-300. International Spring Seminar on Electronics Technology ISSE. ISSN 2161-2536. ISBN 978-1-7281-1874-1. DOI 10.1109/ISSE.2019.8810175. Dostupné z: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=8810175&tag=1

BUŠEK, D. et al. Thermo-Mechanical Test of SnBi and SnCu Solder Joints on Different Surface Finishes. In: 2019 42nd International Spring Seminar on Electronics Technology (ISSE). 42nd International Spring Seminar on Electronics Technology, Wroclaw, 2019-05-15/2019-05-19. New York: IEEE Press, 2019. International Spring Seminar on Electronics Technology ISSE. ISSN 2161-2536. ISBN 978-1-7281-1874-1. DOI 10.1109/ISSE.2019.8810299. Dostupné z: https://ieeexplore.ieee.org/abstract/document/8810299

HORYNOVÁ, E. a I. BESHAJOVÁ PELIKÁNOVÁ. Evaluation of Oxide Thin Film Layers Prepared by Sputtering. In: 2019 42nd International Spring Seminar on Electronics Technology (ISSE). 42nd International Spring Seminar on Electronics Technology, Wroclaw, 2019-05-15/2019-05-19. New York: IEEE Press, 2019. International Spring Seminar on Electronics Technology ISSE. ISSN 2161-2536. ISBN 978-1-7281-1874-1. DOI 10.1109/ISSE.2019.8810224. Dostupné z: https://ieeexplore.ieee.org/document/8810224

DUŠEK, K. et al. Released of Latent Heat from Solder Joints to Surrounding during Solidification of Solder Alloy - Experimental Study. In: 2019 42nd International Spring Seminar on Electronics Technology (ISSE). 42nd International Spring Seminar on Electronics Technology, Wroclaw, 2019-05-15/2019-05-19. New York: IEEE Press, 2019. International Spring Seminar on Electronics Technology ISSE. ISSN 2161-2536. ISBN 978-1-7281-1874-1. DOI 10.1109/ISSE.2019.8810199.

VESELÝ, P. Nozzle Temperature Effect on 3D Printed Structure Properties. In: Zborník príspevkov z medzinárodnej konferencie ELEKTROTECHNOLÓGIA 2019. ELEKTROTECHNOLÓGIA 2019, Zuberec, 2019-05-21/2019-05-23. Žilina: Združenie elektrotechnikov Slovenska, 2019. s. 126-131. ISBN 978-80-969729-1-3.

MOLHANEC, M. Conceptual Normalisation in Software Engineering. In: Enterprise and Organizational Modeling and Simulation. EOMAS 2019: 15th International Workshop on Enterprise and Organizational Modeling and Simulation, Řím, 2019-06-03/2019-06-04. Springer, Cham, 2019. s. 18-28. 1. sv. 366. ISSN 1865-1348. ISBN 978-3-030-35645-3. DOI 10.1007/978-3-030-35646-0_2.

Stránka vytvořena 04.06.2020 05:00:01
Za obsah odpovídá: RNDr. Patrik Mottl, Ph.D.