Subject description - AD1B13VST

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AD1B13VST Power components and technology Extent of teaching:14KP+6KL
Guarantors:  Roles:P,V Language of
Teachers:  Completion:Z,ZK
Responsible Department:13113 Credits:6 Semester:L


Production systems in electrical engineering will be characterized, their arrangement and basic technologies for mechanical joints and plastic parts. Manufacturing of windings,drying and impregnation processes will also been presented. Next part of a course will be focused on basic technologies for semiconductors including power integration. Beam technologies, technologies using plasma, packaging and basic assembly technologies will also been presented.

Study targets:

Students learn basic types of technological processes used in electrical production as well as with basic types of power electronic components and their properties.

Course outlines:

1. Lasers and laser beam as a technological tool.
2. Electron gun and electron beam as a technological tool. Plasma and plasma technologies.
3. Induction heating. Dielectric heating
4. Processes in the fields of electric power. Fast (rapid) prototyping.
5. Basic semiconductor structures. Characteristics, technological possibilities, realizations.
6. Power PIN and Schottky diodes. Static and dynamic parameters. Static and dynamic characteristics. Applications.
7. Current controlled devices. Thyristors (SCR), GTO, GTC, IGCT. Applications.
8. Voltage controlled devices (VDMOS, TMOS). IGBT, Structure and parameters. Applications.
9. Power integration. Power modules, principles, construction, technology. IPM. Cooling. Applications.
10. Winding of electrical machines - types, technology, drying, applications
11. Magnetic circuits of electrical machines - types, technology
12. Technology of surface finishes and protective layers.
13. Production systems in electrical engineering, types, arrangement.

Exercises outline:

1. Organization of labs, safety in the laboratory, explanation and demonstration of tasks 1 to 2
2. Explanation and demonstration of tasks 3 to 6
3. Vacuum drying and impregnation.
4. Soft soldering in electrical engineering.
5. Joining of power cables.
6. Joining of conductors and cables. Test.
7. Drilling and checking of PC boards.
8. Sputtering and evaporation of thin films.
9. Explanation and demonstration of tasks 7 to 9.
10. Task 7
11. Task 8
12. Task 9
13. Checking of laboratory results.
14. Assessment.


1. Benda, V. et al: Power Semiconductor Devices - Theory and Applications, J. Wiley, 1999
2. Bruce, R. G. et al.: Modern Materials and Manufacturing Processes, Prentice Hall, 2003
3. Pokharel, B. P., Karki, R. N.: Electrical Engineering Materials. Alpha Science, Oxford, 2007
4. Herman, S. L.: Electrical machines and transformers. Cengape Learning. 2012


A student must attend at a practical training and must obtain an assessment before examination. A knowledge of lectured matter and laboratory tasks will be required at examination.


A student has to obtain a credit before an examination.



Power electronic components, basic technological processes

Subject is included into these academic programs:

Program Branch Role Recommended semester
BKOI1 Computer Systems V 4
BKOI_BO Common courses V 4
BKOI3 Software Systems V 4
BKOI2 Computer and Information Science V 4
BKEEM1 Applied Electrical Engineering P 4
BKEEM_BO Common courses P 4
BKEEM2 Electrical Engineering and Management P 4
BKKYR1 Robotics V 4
BKKYR_BO Common courses V 4
BKKYR3 Systems and Control V 4
BKKYR2 Sensors and Instrumentation V 4
BKKME1 Communication Technology V 4
BKKME_BO Common courses V 4
BKKME4 Network and Information Technology V 4
BKKME3 Applied Electronics V 4
BKKME2 Multimedia Technology V 4
BIS(ECTS)-D Intelligent Systems V 4
BKSTMWM Web and Multimedia V 4
BKSTMSI Software Engineering V 4
BKSTMMI Manager Informatics V 4
BKSTMIS Intelligent Systems V 4
BKSTM_BO Common courses V 4
BSI(ECTS)-D Software Engineering V 4
BWM(ECTS)-D Web and Multimedia V 4
BMI(ECTS)-D Manager Informatics V 4

Page updated 6.12.2019 17:52:32, semester: Z,L/2020-1, L/2018-9, Z,L/2019-20, Send comments about the content to the Administrators of the Academic Programs Proposal and Realization: I. Halaška (K336), J. Novák (K336)