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Explanatory Notes
Instructions
Anotation:
Students will gain advanced knowledge in analog and digital integrated circuit design. The subject itself
deals with the hierarchical design of integrated circuits in BCD technologies compared to CMOS technologies.
The subject further emphasizes good design practices, advanced building blocks in BCD technologies, advanced IP blocks and
their design process. An integral part of the subject are topics focused on the design of power MOSFETs,
Linear voltage regulators (LDO), electronic fuses eFUSE, switching power supplies on a chip (SMPS)
digital Front-end (FE) and digital Back-end (BE) design and detailed analysis of layouts. The subject is dealt with further
advanced error analysis methods, using analytical methods such as optical and electron microscopy,
(Optical Beam Induced Resistance Change - Obirch and Emission Microscopy EmMi).
Content:
Students will gain advanced knowledge in analog and digital integrated circuit design. The subject itself
deals with the hierarchical design of integrated circuits in BCD technologies compared to CMOS technologies.
The subject further emphasizes good design practices, advanced building blocks in BCD technologies, advanced IP blocks and
their design process. An integral part of the subject are topics focused on the design of power MOSFETs,
Linear voltage regulators (LDO), electronic fuses eFUSE, switching power supplies on a chip (SMPS)
digital Front-end (FE) and digital Back-end (BE) design and detailed analysis of layouts. The subject is dealt with further
advanced error analysis methods, using analytical methods such as optical and electron microscopy,
(Optical Beam Induced Resistance Change - Obirch and Emission Microscopy EmMi).
Course outlines:
Osnovy přednášek:
| 1. | | Birth of a new chip; hierarchy design, discrete vs. IC implementation, description of BCD technology. |
| 2. | | Good design practices - Mirroring, cascoding, sizing/dimensioning, matching, current capability, Rdson, |
Comon Mode+CASC, downscaling in digital vs analog, Grounding, accuracy analog ICs.
| 3. | | Advanced IC building blocks design - part I – Precise voltage and current reference, Advanced Configurable |
Dividers, Mix mode circuits (ADC, DAC etc).
| 4. | | Advanced IC building blocks design - part II - Level shifter, Current sensor, Charge pump Oscillator, etc. |
| 5. | | Advanced IP block block design - Linear voltage regulators (LDOs), eFUSE, Switched-mode power supply |
(SMPS)
| 6. | | Advanced layout design flow - analog TOP, digital TOP; Layout dependent effects (WPE, STI, wSTI, ant. diode, |
PID, metal stress); floorplan (top-bottom, bottom-top, noise IP, sensitive IP, pad position)
| 7. | | Chip as mine field: ESD protection, latch-up immunity, Trimming, Testability; Parasitic, Post Layout |
Simulation, Tunings.
| 8. | | PWR MOSFETs design in analog circuits: drift, extended drain, voltage class |
| 9. | | Digital IC design FE - part I: STA, clock tree, synthesis, implementation |
| 10. | | Digital IC design FE + TOP level verification: behavioral models; AMS simulation, verification flow |
| 11. | | Digital IC design BE - part I: Synthesis, Floor plan |
| 12. | | Digital IC design BE - part II: Place and route, IR drop analysis, DRC, LVS |
| 13. | | Bug analysis methods in IC design flow: Electrical measurement, reproduction, Optical, electron microscopy, |
SAW, X-ray, IR, Obirch, LASER cut, FIB cut + deposition, Hypothesis, isolation, prove, metal fix
Exercises outline:
| 1. | | BCD technology description, chip description follows, IPs in schematic and layout on the project, |
| 2. | | Sizing and matching in advanced ICs, fingers vs. multiply transistor division. |
| 3. | | Precise reference sources design (Voltage reference, Current reference, Divider) |
| 4. | | How to design Advanced OpAmp, improved Miller OpAmps (by using telescope CM, cascode) |
| 5. | | How to create a hierarchy in ICs (Ref.+OpAmp) |
| 6. | | Advanced layout design practices of matched IP blocks – Part I 7. Advanced layout design practices of matched IP blocks – Part II + PLS |
| 8. | | Power MOS layout (including metallization design) |
| 9. | | Digital FE - part I: How to write RTL code with focus on synthesis and implementation into ASIC technology |
process
| 10. | | Digital FE - part II: How to write RTL code with focus on synthesis and implementation into ASIC technology |
process
| 11. | | Digital BE - part I: How to deal with advanced synthesis |
| 12. | | Digital BE - part II: How to implement standard cells (placement and routing) or FPGA implementation |
| 13. | | Digital BE - IR drop analysis, DRC, LVS |
| 14. | | Project review |
Literature:
Recommended references:
Analog design:
| 1) | | Razavi: Design of Analog CMOS Integrated Circuits, McGRAW-Hill, |
| 2) | | Murari, F. Bertotti, G.A.Vignola: Smart Power ICs, Springer, |
| 3) | | Gray, P Hurst, s. Lewis, R. Mayer: Analysis and Design of Analog Integrated Circuits, John Wiley and Sons. |
Analog design:
| 1) | | Analysis and Design of Analog Integrated Circuits, 5th Edition, by J. Paul R. Gray, Paul J. Hurst, Stephen H. |
Lewis, Robert G. Meyer
| 2) | | Analog Integrated Circuit Design, by Tony Chan Carusone, David Johns, Kenneth Martin |
Analog layout:
| 1) | | The Art of Analog Layout, by Alan Hastings |
| 2) | | Fundamentals of Power Semiconductor Devices, by BJ Baliga |
| 3) | | Analog-to-Digital Conversion, by Marcel J.M. Pelgrom |
Digital design:
| 1) | | P. J. Ashenden, The Designer's Guide to VHDL, Morgan Kaufmann, 2008 |
Requirements:
Subject is included into these academic programs:
| Page updated 27.4.2024 15:51:05, semester: Z/2024-5, Z,L/2023-4, Send comments about the content to the Administrators of the Academic Programs |
Proposal and Realization: I. Halaška (K336), J. Novák (K336) |