Faculty of Electrical Engineering

Czech Technical University in Prague

CTU in Prague

State doctoral exam topics

Electrotechnology and Materials

Materials

  1. Internal structure of the basic group of materials (metals, polymers, ceramics, glass, composite materials) and the influence of the structure on the electrical, mechanical and other properties of these material groups.
  2. Mechanism of formation of solids by crystallization, vitrification and agglomeration. Influence of external conditions and the internal structure of a substance on the mechanism of solid formation. Methods for crystal growth and technology for metallic glasses preparation.
  3. Structural mechanisms and kinetics of diffusion. Phase transitions, binary equilibrium phase diagrams and kinetic diagrams of phase transitions. Explanation of basic concepts and the use of phase diagrams. Zone purification technology.
  4. Dispersing methods, the formation of surface charge of colloids, Van der Waals attractive forces principle, electrical double layer and interactions of colloids, conditions for coagulation of colloids and dispersion stability, electrophoresis, formation of fractals and and ordered structures.
  5. Molecular structure of liquid crystals, nematic, smectic and cholesteric phase. Homeotropical texture and Frederick's transformation.
  6. Spontaneous formation of monomolecular surface layers of surfactants. Organization of surfactants in the volume, micelle structure, biological membranes.
  7. Structure, properties and processing of polymers. Application of polymers and plastics with a view to their specific characteristics. Supramolecular materials and their use in electronics.
  8. Structure of the basic types of carbon materials. The relation between material structure and its properties for graphite, carbon black, fullerenes and nanotubes. Application of graphite, carbon black, and nanotubes in electrical engineering and electronics.
  9. Composites with electrical conductivity, matrix types, types and arrangement of used conductive fillers, percolation threshold, spontaneous growth of the conductive network, and the possibility of its control.
  10. The structure, properties and processing technology for semiconductors. Organic and inorganic semiconductors, elemental and compound materials for photovoltaic cells.
  11. PN junction in semiconductors, material processing technology with respect to its intended properties, examples of the use of PN junction in electronics.
  12. Optimal choice of materials for applications in electrical engineering and electronics, specifically for insulators, capacitors, conductors, superconductors, sensors and actuators.
  13. Diagnostics of materials. Basic methods of chemical and structural analysis, overview of methods for material properties determination, measuring methods of electrical conductivity, dielectric spectra of polymers and conductive composites.
  14. Mechanisms materials aging in electrical and electronic applications. Chemical and electrochemical corrosion, thermo-oxidative degradation and photo-degradation, electromigration and diffusion.
  15. Conduction principles of Electrically Conductive Adhesives, basic ingredients (binder and filler) in ECAs and their influence on the properties of adhesive bonds, degradation of joints formed of electrically conductive adhesives
  16. Electrically conductive adhesives with isotropic and anisotropic conductivity, the principle of electrical anisotropy, application of anisotropically conductive adhesives

Technology of Power Devices

  1. Electrical properties of dielectrics. Optical properties of dielectrics. Aging of insulators. Electrical properties of semiconductors. PN junction and its properties. Photovoltaic systems.
  2. Kryotechnology. Low temperature properties of solids. Low pressure technology. Technology and properties of superconductors and their applications.
  3. The technical preparation of electronic production, analysis of components?, integration and mutual linkages in the production system, the application of automation and information technology.
  4. Flexible manufacturing systems and their technical and economic analysis and application in the manufacture of electrical devices.
  5. Progressive materials, structure and technology, their use in the manufacture of power devices. Analysis of the current situation and future perspectives.
  6. Insulating systems for large rotary electric machines, materials and manufacturing technology. Diagnostics during production and operation.
  7. Insulation systems for large transformers, materials and manufacturing technology. Diagnostics during production and operation.
  8. Technology in power semiconductor devices and equipment. Diagnostics during production and operation.
  9. Power conductors and telecommunication cables - properties and technology. Installation of cables, cable systems. Diagnostics during production and operation
  10. The use of software in industrial engineering. The use of information resources in electrical engineering. Resource management and computerized production system

Electronic devices technology

  1. Passive electronic components and their manufacturing technology. Components for applications in broadband and pulse circuits and EMC filters, Magnetic materials used.
  2. Diagnostics of electronic components based on the detection of non-linearity and intermodulation distortion. Measurement of small non-linearities of passive electronic components.
  3. Substrates for printed circuit boards, diversification of surface finishes, techniques for conductive patterns creation. Special techniques for the printed circuit boards manufacturing. Testing equipment for measurement and control of printed circuit boards.
  4. Manufacturing technologies in electronics. Encapsulation and interconnection techniques for the first and second levels. Measuring and testing technology and methods for electronic assembly.
  5. Cooling and thermal regulation of electronic components, modules, subsystems and devices. Housing construction of related semiconductor devices and monolitic and hybrid integrated circuits with regard to thermal properties. Electrical and thermal design of multichip modules.
  6. Electron beam technology for materials processing and for manufacturing of electronic components. Laser, electron, ion and molecular beam.
  7. Production technology with the use of plasma, high and low pressure sputtering, ion and plasma etching, plasma spraying.
  8. Multichip modules based on thin film technology (MCM-D). Multichip modules based on thick-film technology (MCM-C). Hybrid integrated circuits.
  9. Technology of metallic and high-temperature superconductors and components from these materials. Technology for achieving low temperatures, Application of low temperatures in diagnostics of materials and devices.
  10. Ergonomic and ecological aspects of electronic devices production. Cleanliness of environment. Protection of components and equipment from the effects of static electricity.
  11. Diagnostics Electronic components diagnostics based on the measurement of electrical current noise and residual parameters in a wide frequency range.
  12. Diagnostics of electronic components based on the measurement of non-linearity of volt-ampere characteristics.
  13. Optical phenomena in semiconductors and their technical and technological applications.
  14. Methods of transformation of data with non-Gaussian distribution to data with Gaussian distribution for applications in statistical quality control.
  15. Eligibility of the production equipment and manufacturing process; assessment techniques. Process control charts for measurement evaluation and comparison of their interpretation.
  16. Sampling procedures for inspection by measurement or evaluation, sampling plans, the risk of supplier and customer, acceptance characteristic

Automated manufacturing systems

  1. Manufacturing processes control: structure of mutual interactions. Automation of technological processes, handling and storage subsystems of the manufacturing process. Flexible manufacturing systems.
  2. Technical preparation in various categories of the manufacturing system. Flexible manufacturing systems. Computer Aided technical preparation of the production. Software tools and their use.
  3. Application of analytical methods and methodologies suitable for the analysis of production information systems. Data, functional and object modeling. The use of ERD, DFD, STD and UML diagrams.
  4. Technical means for production control. Control computers and their peripherals, requirements, quality criteria. The requirements and criteria for production control software.
  5. Real time computer aided control of manufacturing systems. Process states, semaphores, dead-lock, synchronization. Programming languages and operating systems suitable for RT applications.
  6. Quality management systems in production. Quality management in various stages of product implementation, document management and management of quality records. Methods of quality monitoring and measurement.
  7. Effect of electrical equipment on the electrical energy quality; quality criteria. Passive and active means for an improvement of the electromagnetic compatibility of power devices and systems.
  8. System analysis via modelling and simulation. Equivalence of different models of physical systems. Software tools for computer simulation, application areas, comparison.
Responsible person: RNDr. Patrik Mottl, Ph.D.