Faculty of Electrical Engineering

Czech Technical University in Prague

CTU in Prague

State doctoral exam topics

Electronics

  1. The crystal structure of the solid state, the reciprocal lattice, defects in crystalline solid, lattice vibrations, phonons.
  2. The energy band structure of semiconductor in the momentum space, the density of quantum states, the effective mass of electron and holes.
  3. The statistics of electron and holes in the equilibrium state, impurity levels and their occupation, the intrinsic and extrinsic semiconductor, the position of the fermi level.
  4. Transport properties of semiconductors, the transport equation, the drift, the diffusion, scattering mechanisms, the carrier mobility, mechanisms of generation and recombination, the impact ionization.
  5. Principles used in photonics and optoelectronics, linear and nonlinear optical environment, interaction and propagation of radiation in optical environment, the most important application area.
  6. The PN junction, the contact metal-semiconductor (MS), the heterojunction, the metal-oxide-semiconductor (MOS) – linear band diagrams, the injection and extraction. Active and passive semiconductor structures – physical and circuit models.
  7. 2D, 1D and 0D structures, energetic states and transport properties of these structures. Application in modern electronic and optoelectronic devices.
  8. Application important discrete semiconductor devices for low and high power processing. Devices and structures for high-frequency applications. Principles, parameters and characteristics.
  9.  Power semiconductor devices. Principles, parameters and characteristics of application important diodes, transistors and thyristors in bipolar, unipolar and combined technology.
  10. Optical fibers and planar waveguides: principle functions and properties, attenuation and dispersion, important parameters of the waveguides, materials and technological solution.
  11. Coherent sources of radiation: gas, liquid, solid- state (dielectric) and injection lasers. Physical principles of function, specific properties, application area.
  12. Passive and dynamic optoelectronic components: coupling and connection elements, optical modulators and switches, optical multi / demultiplexers. Principles of function, properties.
  13. Semiconductor sources of optical radiation: light-emitting diodes, laser diodes. Principles of function, properties.
  14. Optical amplifiers: fiber, solid-state (dielectric), semiconductor. Principles of function, properties, application area.
  15. Photon detectors of optical radiation: photoresistors, PIN photodetectors, avalanche photodetectors, photomultipliers, phototransistors. Operating principles, properties, application area.
  16. Optical sensors: principles used features, various types of sensors properties, application area.
  17. Integrated circuit (IC) technologies. IC manufacturing processes and materials. Lithography, diffusion and ion implantation, thin film deposition, etching, passivation, packaging, nanotechnology.
  18. Unipolar and bipolar integrated structures. Rules and methodology for layout and interconnection, design rules; device models and model libraries.
  19. Simulation tools for manufacturing processes and semiconductor structures in relation to the circuit simulation. Parameter extraction for IC device model.
  20. Integrated systems Synthesis. Functional verification, Logic synthesis at register transfer level.  Physical design and synthesis. HDL and AHDL languages, automated design, simulation, verification, testing.
  21. Digital IO architectures and macroblocks. Logic gates, combinational and sequential logic blocks, memory. Microprocessor architectures. Application-specific and reconfigurable ICs, system on a chip.
  22. Analog and mixed-signal integrated circuits architectures and macro blocks. Amplifiers, voltage and current references, operational amplifiers. Design principles of analog ICs. Corner and noise analysis.
  23. Microsystems. Physical, chemical and biochemical principles of the operation. Structures MEMS, MOEMS, MOES. Technologies. Signal processing. Design methods.
  24. Microactuators. Physical principles of the operation, materials, structures, signal processing. Micro realization, design.
  25. Microsensors and sensor systems. Physical, chemical and biochemical principles of the structure operation. Sensor signal processing. Smart sensors and systems.
  26. Application of ICs, sensors and microactuators in the design of electronic systems, devices and equipment, EMC.
  27. Optical communication systems: principles of function, specific properties, components, energy balance system, optical networks, use of optical multiplex.
  28. Integrated optics: principles, components, material and technological solutions, examples of optical integrated circuits.
  29. Trends in development of IC, optical circuits and microsystems, new principles, materials and structures, 3D integration methods, intelligent microsystems.
Responsible person: RNDr. Patrik Mottl, Ph.D.