13000 / 13113 - Department of Electrotechnology

Publications 2021

Papers in WoS Journals

GOHARI, S., V. KNAP, and M.R. YAFTIAN. Investigation on Cycling and Calendar Aging Processes of 3.4 Ah Lithium-Sulfur Pouch Cells. SUSTAINABILITY. 2021, 13(16), 1-13. ISSN 2071-1050. DOI 10.3390/su13169473. Available from: https://www.mdpi.com/2071-1050/13/16/9473/htm

ŽELEZNÝ, J., et al. Unidirectional magnetoresistance and spin-orbit torque in NiMnSb. PHYSICAL REVIEW B. 2021, 104(5), 1-13. ISSN 2469-9950. DOI 10.1103/PhysRevB.104.054429.

KNAP, V. and D.-I. STROE. Effects of open-circuit voltage tests and models on state-of-charge estimation for batteries in highly variable temperature environments: Study case nano-satellites. Journal of Power Sources. 2021, 498 1-10. ISSN 0378-7753. DOI 10.1016/j.jpowsour.2021.229913.

KÜNZEL, K., et al. Electromagnetic Properties of Steel Fibres for Use in Cementitious Composites, Fibre Detection and Non-Destructive Testing. Materials. 2021, 14(9), ISSN 1996-1944. DOI 10.3390/ma14092131. Available from: https://www.mdpi.com/1996-1944/14/9/2131

POULEK, V., et al. PV Panel and PV Inverter Damages Caused by Combination of Edge Delamination, Water Penetration, and High String Voltage in Moderate Climate. IEEE Journal of Photovoltaics. 2021, 11(2), 561-565. ISSN 2156-3381. DOI 10.1109/JPHOTOV.2021.3050984.

ALAYA, M., et al. Validation of Heat-Level Vapor Phase Soldering Process and Workspace Leakage Detection with Applied Pressure Sensors. Applied Sciences. 2021, 11(4), ISSN 2076-3417. DOI 10.3390/app11041755. Available from: https://www.mdpi.com/2076-3417/11/4/1755

HOLOVSKÝ, J., et al. Pulsed laser deposition of high-transparency molybdenum oxide thin films. Vacuum. 2021, 194 110613(1)-110613(7). ISSN 0042-207X. DOI 10.1016/j.vacuum.2021.110613.

BOLDRIN, D., et al. Barocaloric properties of quaternary Mn3(Zn,In)N for room-temperature refrigeration applications. PHYSICAL REVIEW B. 2021, 104(13), 1-7. ISSN 2469-9950. DOI 10.1103/PhysRevB.104.134101.

JOHNSON, F., et al. Strain dependence of Berry-phase-induced anomalous Hall effect in the non-collinear antiferromagnet Mn3NiN. Applied Physics Letters. 2021, 119(222401), 1-6. ISSN 0003-6951. DOI 10.1063/5.0072783.

SINGH, H.K., et al. Multifunctional antiperovskites driven by strong magnetostructural coupling. njp computational materials. 2021, 7(1), 1-9. ISSN 2057-3960. DOI 10.1038/s41524-021-00566-w.

ZLOUŽELOVÁ, K., et al. PARTIALLY SINTERED LEAD-FREE CERAMICS FROM PIEZOELECTRIC POWDERS PREPARED VIA CONVENTIONAL FIRING AND SPARK PLASMA SINTERING (SPS) – – CHARACTERIZATION OF MICROSTRUCTURE AND DIELECTRIC PROPERTIES. Ceramics-Silikáty. 2021, 65(1), 30-37. ISSN 0862-5468. DOI 10.13168/cs.2020.0039.

ILLÉS, B., et al. Sn and Bi whisker growth from SAC0307-Mn07 and SAC0307-Bi1-Mn07 ultra-thin film layers. Vacuum. 2021, 187 ISSN 0042-207X. DOI 10.1016/j.vacuum.2021.110121.

TICHÝ, T., et al. Mathematical Modelling of Temperature Distribution in Selected Parts of FFF Printer during 3D Printing Process. Polymers. 2021, 13(23), ISSN 2073-4360. DOI 10.3390/polym13234213. Available from: https://www.mdpi.com/2073-4360/13/23/4213

FINSTERLE, T., et al. Diagnostics of PID Early Stage in PV Systems. Energies. 2021, 14(8), ISSN 1996-1073. DOI 10.3390/en14082155. Available from: https://doi.org/10.3390/en14082155

BURYI, M., et al. Influence of Mo doping on the luminescence properties and defect states in ZnO nanorods. Comparison with ZnO:Mo thin films. Applied Surface Science. 2021, 555 ISSN 0169-4332. DOI 10.1016/j.apsusc.2021.149679.

SONG, S., et al. Performance evaluation of lithium-ion batteries (LiFePO4 cathode) from novel perspectives using a new figure of merit, temperature distribution analysis, and cell package analysis. Journal of Energy Storage. 2021, 44 1-11. ISSN 2352-152X. DOI 10.1016/j.est.2021.103413.

MARKVART, T. Ideal solar cell efficiencies. Nature Photonics. 2021, 15 163-164. ISSN 1749-4885. DOI 10.1038/s41566-021-00772-4.

DUŠEK, K., et al. Influence of Flux and Related Factors on Intermetallic Layer Growth within SAC305 Solder Joints. Materials. 2021, 14(24), ISSN 1996-1944. DOI 10.3390/ma14247909. Available from: https://www.mdpi.com/1996-1944/14/24/7909

FROŠ, D., K. DUŠEK, and P. VESELÝ. Investigation of Impacts on Printed Circuit Board Laminated Composites Caused by Surface Finish Application. Polymers. 2021, 13(19), ISSN 2073-4360. DOI 10.3390/polym13193203. Available from: https://www.mdpi.com/2073-4360/13/19/3203

DUŠEK, K., et al. Analysis of a failure in a molded package caused by electrochemical migration. Engineering Failure Analysis. 2021, 121 1-8. ISSN 1350-6307. DOI 10.1016/j.engfailanal.2020.105128.

BURYI, M., et al. Stabilization of light emitting Eu2+ centers inside Ca(Sr)I-2:Eu particles in glass ceramics. The preliminary concept of synthesis. Ceramics International. 2021, 47(20), 29232-29252. ISSN 0272-8842. DOI 10.1016/j.ceramint.2021.07.088.

BURYI, M., et al. Transformation of free-standing ZnO nanorods upon Er doping. Applied Surface Science. 2021, 562 ISSN 0169-4332. DOI 10.1016/j.apsusc.2021.150217.

PETER AMALATHAS, A., et al. Unveiling the Effect of Potassium Treatment on the Mesoporous TiO2/ Perovskite Interface in Perovskite Solar Cells. ACS Applied Energy Materials. 2021, 4(10), 11488-11495. ISSN 2574-0962. DOI 10.1021/acsaem.1c02229. Available from: https://pubs.acs.org/doi/10.1021/acsaem.1c02229

ŠEBERA, J., et al. FTIR Measurement of the Hydrogenated Si(100) Surface: The Structure-Vibrational Interpretation by Means of Periodic DFT Calculation. Journal of Physical Chemistry C. 2021, 125(17), 9219-9228. ISSN 1932-7455. DOI 10.1021/acs.jpcc.0c11176. Available from: https://pubs.acs.org/doi/10.1021/acs.jpcc.0c11176

Patents

ČVUT v Praze. Ruční dávkovač pastovitých látek. Inventors: R. BORTEL, et al. Czechia. Patent CZ 308725. 2021-02-17. Available from: https://isdv.upv.cz/webapp/resdb.print_detail.det?pspis=PT/2019-601&plang=CS

Papers in Other Journals

STRAUBINGER, D., et al. Modelling of thermocouple geometry variations for improved heat transfer monitoring in smart electronic manufacturing environment. SSRN. 2021, 1-15. ISSN 1556-5068. DOI 10.2139/ssrn.3972769.

ROZTOČIL, J., et al. Porovnávání časových stupnic UTC(FEL) a UTC(TP) pomocí technologie White Rabbit. Metrologie. 2021, 30(4/2021), 9-15. ISSN 1210-3543.

PETRÁŠEK, J., et al. Synthesis and Pressure-Assisted Sintering of CaCu3Ti4O12 Dielectrics. Ceramics. 2021, 2021(4), 447-466. ISSN 2571-6131. DOI 10.3390/ceramics4030033. Available from: https://www.mdpi.com/journal/ceramics/imprint

BENDA, V. Současný vývoj v oblasti fotovoltaiky. Inovační podnikání & transfer technologií. 2021, 29(3), 7-8. ISSN 1210-4612.

Books, Book Chapters and Lecture Notes

DUŠEK, K., D. BUŠEK, and P. VESELÝ. Overview of Selected Issues Related to Soldering. In: Welding - Modern Topics. London: IntechOpen Limited, 2021. ISBN 978-1-83881-896-8. DOI 10.5772/intechopen.91023. Available from: https://www.intechopen.com/chapters/70995

BENDA, V. and G. WACHUTKA, eds. ISPS'21 PROCEEDINGS. Praha, 2021-08-26/2021-08-27. Praha: Czech Technical University in Prague, 2021. 1. vol. 1. ISBN 978-80-01-06874-8.

Conference Proceedings

KADLECOVÁ, A., I. KRÁLOVÁ, and P. VESELÝ. Mechanical and Thermal Consequences of Added Phosphorus and Gallium in Lead-free Alloy Based on Bismuth and Tin. In: 2021 44th International Spring Seminar on Electronics Technology (ISSE). 2021 44th International Spring Seminar on Electronics Technology, Bautzen, 2021-05-05/2021-05-09. New York: IEEE Press, 2021. p. 1-5. International Spring Seminar on Electronics Technology (ISSE). ISSN 2161-2528. ISBN 978-1-6654-1477-7. DOI 10.1109/ISSE51996.2021.9467640. Available from: https://ieeexplore.ieee.org/document/9467640

VESELÝ, P. and D. FROŠ. Evaluation of Long-term Stability of Bismuth-Tin Solder Joint Properties in Dependence on Reflow Conditions. In: 2021 44th International Spring Seminar on Electronics Technology (ISSE). 2021 44th International Spring Seminar on Electronics Technology, Bautzen, 2021-05-05/2021-05-09. New York: IEEE Press, 2021. p. 1-7. International Spring Seminar on Electronics Technology (ISSE). ISSN 2161-2528. ISBN 978-1-6654-1477-7. DOI 10.1109/ISSE51996.2021.9467630. Available from: https://ieeexplore.ieee.org/document/9467630

KLIMTOVÁ, M. and P. VESELÝ. Evaluation of Anisotropy of Additively Manufactured Structures. In: 2021 44th International Spring Seminar on Electronics Technology (ISSE). 2021 44th International Spring Seminar on Electronics Technology, Bautzen, 2021-05-05/2021-05-09. New York: IEEE Press, 2021. p. 1-6. International Spring Seminar on Electronics Technology (ISSE). ISSN 2161-2528. ISBN 978-1-6654-1477-7. DOI 10.1109/ISSE51996.2021.9467633. Available from: https://ieeexplore.ieee.org/document/9467633

DUŠEK, K., et al. Workplace for Demonstration of Electrochemical Migration Effect on Printed Circuit Boards. In: 2021 44th International Spring Seminar on Electronics Technology (ISSE). 2021 44th International Spring Seminar on Electronics Technology, Bautzen, 2021-05-05/2021-05-09. New York: IEEE Press, 2021. International Spring Seminar on Electronics Technology (ISSE). ISSN 2161-2528. ISBN 978-1-6654-1477-7. DOI 10.1109/ISSE51996.2021.9467605. Available from: https://ieeexplore.ieee.org/document/9467605

PRAŽANOVÁ, A. and V. KNAP. Electrical Circuit Model of Lithium-Ion Batteries and Revisiting of Its Parametrization Procedures. In: ECS Transactions. Advanced Batteries, Accumulators and Fuel Cells (ABAF 22), Brno, 2021-08-22/2021-08-25. New Jersey: The Electrochemical Society, 2021. p. 487-499. vol. 105. ISSN 1938-5862. DOI 10.1149/10501.0487ecst.

KNAP, V., et al. Battery temperature behavior in CubeSats at low Earth orbit: From telemetry to ground testing. In: Proceedings of the International Astronautical Congress, IAC. International Astronautical Congress, Dubai, 2021-10-25/2021-10-29. Paris: International Astronautical Federation (IAF), 2021. p. 1-7. ISSN 0074-1795.

DOUSEK, D., et al. Long-term stability of hollow core to standard optical fiber interconnection. In: Micro-structured and Specialty Optical Fibres VII. SPIE Optics + Optoelectronics, Praha, 2021-04-19/2021-04-23. Bellingham (stát Washington): SPIE, 2021. p. 1-6. ISSN 0277-786X. ISBN 978-1-5106-4381-9. DOI 10.1117/12.2592377.

HÁJEK, J., V. PAPEŽ, and M. HORÁK. New method for Si-wafer resistivity determination. In: BENDA, V. and G. WACHUTKA, eds. ISPS'21 PROCEEDINGS. 15th INTERNATIONAL SEMINAR ON POWER SEMICONDUCTORS, Praha, 2021-08-26/2021-08-27. Praha: Czech Technical University in Prague, 2021. p. 135-140. 1. vol. 1. ISBN 978-80-01-06874-8. DOI 10.14311/ISPS.2021.021.

MACH, P. and R. LACINA. Climatic Aging of Conductive Adhesive Joints on Pads with Different Surface Finishes. In: 2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME). SIITME 2021 - IEEE 27th International Symposium for Design and Technology in Electronic Packaging, Timisoara, 2021-10-25/2021-10-30. New York: IEEE Press, 2021. p. 156-159. ISBN 978-1-6654-2110-2. DOI 10.1109/SIITME53254.2021.9663676. Available from: https://ieeexplore.ieee.org/document/9663676

UŘIČÁŘ, J. and J. MINÁŘ. Stereolithography Resins with Conductive Fillers: An Effective Way to Enhance their Electrical Properties. In: 2021 44th International Spring Seminar on Electronics Technology (ISSE). 2021 44th International Spring Seminar on Electronics Technology, Bautzen, 2021-05-05/2021-05-09. New York: IEEE Press, 2021. p. 1-4. International Spring Seminar on Electronics Technology (ISSE). ISSN 2161-2528. ISBN 978-1-6654-1477-7. DOI 10.1109/ISSE51996.2021.9467669. Available from: https://ieeexplore.ieee.org/document/9467669

KOZÁK, M. and K. DUŠEK. Influence of Stress Factors on the Whiskers Growth on Sn-Cu Based Surfaces. In: 2021 44th International Spring Seminar on Electronics Technology (ISSE). 2021 44th International Spring Seminar on Electronics Technology, Bautzen, 2021-05-05/2021-05-09. New York: IEEE Press, 2021. International Spring Seminar on Electronics Technology (ISSE). ISSN 2161-2528. ISBN 978-1-6654-1477-7. DOI 10.1109/ISSE51996.2021.9467629. Available from: https://ieeexplore.ieee.org/document/9467629

MACH, P. and R. LACINA. Noise Diagnostics of Climatically Treated Joints Formed from Conductive Adhesives. In: 2021 44th International Spring Seminar on Electronics Technology (ISSE). 2021 44th International Spring Seminar on Electronics Technology, Bautzen, 2021-05-05/2021-05-09. New York: IEEE Press, 2021. p. 1-4. International Spring Seminar on Electronics Technology (ISSE). ISSN 2161-2528. ISBN 978-1-6654-1477-7. DOI 10.1109/ISSE51996.2021.9467510. Available from: https://ieeexplore.ieee.org/document/9467510

KRÁLOVÁ, I., et al. Influence of Added Phosphorus and Gallium in Lead-free Bismuth-Tin Alloys on Wetting and Intermetallic Compounds. In: 2021 44th International Spring Seminar on Electronics Technology (ISSE). 2021 44th International Spring Seminar on Electronics Technology, Bautzen, 2021-05-05/2021-05-09. New York: IEEE Press, 2021. p. 1-6. International Spring Seminar on Electronics Technology (ISSE). ISSN 2161-2528. ISBN 978-1-6654-1477-7. DOI 10.1109/ISSE51996.2021.9467660. Available from: https://ieeexplore.ieee.org/document/9467660

MINÁŘ, J., et al. Electrical Properties of Photopolymers for 3D Printing. In: 2021 44th International Spring Seminar on Electronics Technology (ISSE). 2021 44th International Spring Seminar on Electronics Technology, Bautzen, 2021-05-05/2021-05-09. New York: IEEE Press, 2021. p. 1-5. International Spring Seminar on Electronics Technology (ISSE). ISSN 2161-2528. ISBN 978-1-6654-1477-7. DOI 10.1109/ISSE51996.2021.9467515. Available from: https://ieeexplore.ieee.org/document/9467515

KNAP, V., et al. Calendar Degradation and Self-Discharge Occurring During Short- and Long-Term Storage of NMC Based Lithium-Ion Batteries. In: ECS Transactions. Advanced Batteries, Accumulators and Fuel Cells (ABAF 22), Brno, 2021-08-22/2021-08-25. New Jersey: The Electrochemical Society, 2021. p. 3-11. 105. vol. 1. ISSN 1938-6737. ISBN 9781607685395. DOI 10.1149/10501.0003ecst. Available from: https://iopscience.iop.org/article/10.1149/10501.0003ecst/meta

BENDA, V. Present and future photovoltaic modules –Trends and limits. In: GLOBAL SUMMIT ON FUTURE OF MATERIALS SCIENCE AND RESEARCH. FUTURE OF MATERIALS 2021, Vancouver, 2021-07-29/2021-07-30. Vancouver: Peers Alley Media 1126 59 Ave East, V5X 1Y9 Vancouver BC, Canada, 2021.

FROŠ, D. and P. VESELÝ. Comparative Study Focused on Mechanical Properties of Solder Joints Considering Solder Pad Surface Finish. In: 2021 44th International Spring Seminar on Electronics Technology (ISSE). 2021 44th International Spring Seminar on Electronics Technology, Bautzen, 2021-05-05/2021-05-09. New York: IEEE Press, 2021. p. 1-6. International Spring Seminar on Electronics Technology (ISSE). ISSN 2161-2528. ISBN 978-1-6654-1477-7. DOI 10.1109/ISSE51996.2021.9467552. Available from: https://ieeexplore.ieee.org/document/9467552

SOROKINA, K., D. BUŠEK, and K. DUŠEK. Comparison of Gold-Plated PCB Finishes after Thermal Stress. In: 2021 44th International Spring Seminar on Electronics Technology (ISSE). 2021 44th International Spring Seminar on Electronics Technology, Bautzen, 2021-05-05/2021-05-09. New York: IEEE Press, 2021. International Spring Seminar on Electronics Technology (ISSE). ISSN 2161-2528. ISBN 978-1-6654-1477-7. DOI 10.1109/ISSE51996.2021.9467593.

MACH, P. and M. HORÁK. Study of Changes in the Dissipation Factor of PP Film Capacitors Caused by Heat Treatment. In: 2021 44th International Spring Seminar on Electronics Technology (ISSE). 2021 44th International Spring Seminar on Electronics Technology, Bautzen, 2021-05-05/2021-05-09. New York: IEEE Press, 2021. p. 1-5. International Spring Seminar on Electronics Technology (ISSE). ISSN 2161-2528. ISBN 978-1-6654-1477-7. DOI 10.1109/ISSE51996.2021.9467566. Available from: https://ieeexplore.ieee.org/document/9467566

BURYI, M., et al. TRANSFORMATION OF ZNO-BASED STRUCTURES UNDER HEAVY MO DOPING: DEFECT STATES AND LUMINESCENCE. In: Conference Proceedings - NANOCON 2021, 13th International Conference on Nanomaterials - Research & Application. 13th International Conference on Nanomaterials - Research & Application, Brno, 2021-10-20/2021-10-22. Ostrava: Tanger Ltd., 2021. p. 74-79. ISSN 2694-930X. ISBN 978-80-88365-00-6. DOI 10.37904/nanocon.2021.4321.

MACH, P. and R. LACINA. Mathematical Modeling of Resistance of Conductive Adhesive Joints in Climatic Aging. In: 2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME). SIITME 2021 - IEEE 27th International Symposium for Design and Technology in Electronic Packaging, Timisoara, 2021-10-25/2021-10-30. New York: IEEE Press, 2021. p. 160-164. ISBN 978-1-6654-2110-2. DOI 10.1109/SIITME53254.2021.9663585. Available from: https://ieeexplore.ieee.org/document/9663585