Subject description - AE0B13KEO

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AE0B13KEO Construction of Electronic Circuits Extent of teaching:2+2L
Guarantors:  Roles:V Language of
Teachers:  Completion:Z,ZK
Responsible Department:13113 Credits:4 Semester:Z


Printed circuit boards and modular constructions. Single sided, double sided and multi-layer boards. Through-hole and surface mount technologies. Designing printed circuits patterns. Passive and semiconductor components for electronic circuits. Manual and automated assembly. Soldering techniques. Testing of printed circuit boards during the manufacturing.

Study targets:

A student are well-educated of properties of fundamental electronic devices, theit application at realization of electronic circuits, technology of ralization of PCB and methods of actuating of electronic equipment

Course outlines:

1. Realization methods of electronic circuits
2. Design technique of real circuits
3. Printed circuits board technologies and component bonding
4. Practical design of printed circuits boards
5. Computer design
6. Passive components - specific properties
7. active components - specific properties
8. Power supplies for electronic circuits, design, realization
9. Component assembly. Soldering technique
10. Switching and wiring components
11. Putting into operation, testing
12. Selection of measuring methods and apparatus
13. Design effect on equipment reliability
14. Basic Standards for electronic equipments

Exercises outline:

1. Introduction. Safety provisions. Catalogue of components
2. Methods of realization electronic circuits
3. Printed circuits boards design
4. Computer - aided program Formica
5. Computer - aided program Formica
6. Electronic circuits realization - scheme
7. Electronic circuits realization - function verification
8. Electronic circuits realization - printed circuits boards
9. Component assembly
10. Electronic circuits realization - soldering
11. Circuits function testing
12. Circuits parameters measuring
13. Final report
14. A credit


[1] Leonida, G., Handbook of Printed Circuit Design, Manufacture Components & Assembly. Electrochemical Publications, IOM, 2000


The credit reguirements: seminar presentation, realization of electronic circuit, protokol of circuit realization and the student must obtain minimally 50 % of avaliable points in the tests.



Delectronic devices, PCB mounting

Subject is included into these academic programs:

Program Branch Role Recommended semester
BEKME1 Communication Technology V
BEKME5 Komunikace a elektronika V
BEKME_BO Common courses V
BEKME4 Network and Information Technology V
BEKME3 Applied Electronics V
BEKME2 Multimedia Technology V
BEEEM1 Applied Electrical Engineering V
BEEEM_BO Common courses V
BEEEM2 Electrical Engineering and Management V
BEKYR1 Robotics V
BEKYR_BO Common courses V
BEKYR3 Systems and Control V
BEKYR2 Sensors and Instrumentation V
BEOI1 Computer Systems V
BEOI_BO Common courses V
BEOI3 Software Systems V
BEOI2 Computer and Information Science V

Page updated 19.6.2019 05:53:11, semester: Z,L/2020-1, L/2018-9, Z,L/2019-20, Send comments about the content to the Administrators of the Academic Programs Proposal and Realization: I. Halaška (K336), J. Novák (K336)