Subject description - AE1M13VEZ

Summary of Study | Summary of Branches | All Subject Groups | All Subjects | List of Roles | Explanatory Notes               Instructions
AE1M13VEZ Manufacturing of Electronic Equipment Extent of teaching:2+2L
Guarantors:  Roles:P,V Language of
Teachers:  Completion:Z,ZK
Responsible Department:13113 Credits:5 Semester:Z


Mechanical and electrical design. The electric contact. Joining of conductors. Cooling of components and equipment Printed circuit boards fabrication. Soldering in electronics. Electromagnetic compatibility of electronic equipment. Protection of components and equipment, sensitive on electrostatic field. Certification, accreditation, quality control and quality assurance.

Study targets:

Survey of modern methods of production of electronic devices capable of competition.

Course outlines:

1. Mechanical and electrical design of electronics equipment
2. Electrical contacts. Basic feature. Application.
3. Mechanical, metallurgical and adhesive joints in electronics
4. Influence of environmentalism on construction and materials of joints.
5. PCBs of different types including flexible PCBs
6. Assembly in electronics - THT
7. Assembly in electronics - SMT
8. Production facility for assembly electronics
9. Temperature conditions of components and equipment. Crystal oven, cooling, heat pipe.
10. Manufacturing, operating and working environment.
11. Protection of components and equipment sensitive on electrostatic discharge
12. Electromagnetic compatibility. Shielding of workplaces and equipment
13. In-production control, control of electronic production
14. ISO 9000, ISO 14 000, control and assurance of quality

Exercises outline:

1. Safety of operation in laboratories. Instructions of tasks.
2. Joints, jointing in electronics.
3. Electromechanical contact systems.
4. Measurement of contact resistance of contacts.
5. Fabrication of solder and adhesive joints.
6. Measurement of parameters of soldering and adhesives joints.
7. Electrostatic discharge sensitive components (ESDS).
8. Measurement of ionic contamination of components and PCB.
9. Visit to factory: manufacturing of electronics equipment.
10. Video demonstration - product equipment .
11. Mounting and repair PCB - manufacturing samples - part 1.
12. Mounting and repair PCB - manufacturing samples - part 2.
13. Shielding technology - demonstration and measurement of samples.
14. Evaluation of reports from measurements. A credit.


1. Mach, P., Skočil, Vl., Urbánek J. Montáž v elektronice. Praha: ČVUT. 2001
2. Hwang, J. S. Modern Solder Technology for Competetive Electronics
Manufacturing. McGraw-Hill, New York 1996.
3. Szendiuch, I.: Základy technologie mikroelektronických obvodů a systémů, VUTIUM Brno, 2006. ISBN 80-214-3292-6
4. Pietriková, A.,Ďurišin, J., Mach, P.: Diagnostika a optimalizácia použitia ekologických materialov pre vodivé spájanie v elektronike. FEI TU v Košiciach. ISBN 978-80-553-0447-2
5. Puttlitz, K. J., Stalter, A.K.: Handbook of Lead-Free Solder Technology for Microelectronic Assemblies. Marcel Dekker, Inc. New York - Basel, 2004. ISBN 0-8247-4870-0
6. Li,Yi., Lu, Daniel., Wong, C.P.: Electrical Conductive Adhesives with Nanotechnologies. Springer New York, 2010. ISBN 978-0-387-88782-1
7. Sung Jim Kim, Sang Woo Lee. Air Cooling Technology for Electronic
Equipment. CRC Press, Inc. New York. 1996 Recommended resources on topics (Theman-Litm-kapx): T1-L1-kap1,2,16;T2-L3-kap5,L6-kap9;T3-L3-5,L2-2;T4-L1-7,L3-5,L6-4,5,L4-1;5-1-9,10,11,12;T6-L1-6,L5;T7-L3-4;T8-L3-8,L5;T9-L7;T10-L1-14;T11-L1-14;T12-L2-1,L4-8;T13-L3-6;T14-L1-13,L2-3 Presentation on a particular subject are:


A student has to obtain a credit before an examination.



Electronic equipment. PCB. Assembly of components. Soldered joints. Glued joints. Cooling.

Subject is included into these academic programs:

Program Branch Role Recommended semester
MEKME1 Wireless Communication V 3
MEKME5 Systems of Communication V 3
MEKME4 Networks of Electronic Communication V 3
MEKME3 Electronics V 3
MEKME2 Multimedia Technology V 3
MEEEM5 Economy and Management of Electrical Engineering P 3
MEOI1 Artificial Intelligence V 3
MEOI5NEW Software Engineering V 3
MEOI5 Software Engineering V 3
MEOI4 Computer Graphics and Interaction V 3
MEOI3 Computer Vision and Image Processing V 3
MEOI2 Computer Engineering V 3
MEKYR4 Aerospace Systems V 3
MEKYR1 Robotics V 3
MEKYR3 Systems and Control V 3
MEKYR2 Sensors and Instrumentation V 3

Page updated 24.6.2019 17:52:59, semester: Z,L/2020-1, L/2018-9, Z,L/2019-20, Send comments about the content to the Administrators of the Academic Programs Proposal and Realization: I. Halaška (K336), J. Novák (K336)