3DP Lab - Development and research of materials for 3D printing in electrical engineering

The 3DP Lab research group, based at the Department of Electrical Engineering, is engaged in materials research and development of new and advanced materials for 3D printing using FFF and SLA technologies with applications in electronics and electrical engineering.

The 3DP Lab research group is involved in 3D printing from polymer materials, primarily using Fused Filament Fabrication (printing by extrusion of molten polymer filament) and stereolithography (curing of photopolymer resin with UV light).

  1. The group’s primary research focus is the development of new composite materials applicable in the electrical industry (electrically conductive, dielectric with increased permittivity, piezoelectric, ferromagnetic) and specific application solutions (functional elements, sensors).

  2. Research activities also include characterisation by diagnostic methods (electrical measurements, mechanical tests, thermal analyses, microscopy, elemental analyses, climatic tests, etc.).

  3. It is also exploring the current trend of ecology and environmental impact in the development of a new technology for the production of electronics (printed circuit boards) from recycled polymers.

They collaborate with other research groups as well as industrial partners in contract research. Both Bachelor's and Master's students are actively involved in research as part of semester projects and final theses.

What are we currently working on?

  • Ceramic composite materials
  • Electrically conductive composite materials
  • Environmentally friendly production of printed circuit boards from recycled/recyclable polymers
  • Development of a printed high voltage bushing using a sandwich structure (combination of pure and electrically conductive polymer)
  • Development of sensors using composite, electrically conductive polymers for FFF printing
  • Analysis of volatiles released during 3D printing
  • Development of a printer for liquid phase printing using FFF design

Responsible person Ing. Mgr. Radovan Suk